自然科学版 英文版
自然科学版 英文版
自然科学版 英文版

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中南大学学报(英文版)

Journal of Central South University

Vol. 18    No. 3    June 2011

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Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system
PARK Su-seong, KIM Jae-min, CHUNG Won-jee, SHIN O-chul

School of Mechatronics, Changwon National University, Changwon 641-773, Korea

Abstract:The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes. As a result of testing performance verification of MLCC alignment system, the average alignment rates are 95% for 3216 chip, 88.5% for 2012 chip and 90.8% for 3818 chip. The MLCC alignment system can be accepted for practical use because the average manual alignment is just 80%. In other words, the developed MLCC alignment system has been upgraded to a great extent, compared with manual alignment. Based on the successfully developed MLCC alignment system, the optimal transfer conditions have been explored by using RSM. The simulations using ADAMS® has been performed according to the cube model of CCD. By using MiniTAB®, the model of response surface has been established based on the simulation results. The optimal conditions resulted from the response optimization tool of MiniTAB® has been verified by being assigned to the prototype of MLCC alignment system.

 

Key words: multi-layer ceramic capacitor (MLCC); alignment system; response surface method (RSM); MiniTAB®; ADAMS®

中南大学学报(自然科学版)
  ISSN 1672-7207
CN 43-1426/N
ZDXZAC
中南大学学报(英文版)
  ISSN 2095-2899
CN 43-1516/TB
JCSTFT
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