自然科学版 英文版
自然科学版 英文版
自然科学版 英文版

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中南大学学报(英文版)

Journal of Central South University

Vol. 20    No. 6    June 2013

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Analysis of steady heat conduction for 3D axisymmetric functionally graded circular plate
LIU Wu-xiang(刘五祥)

School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai 200092, China

Abstract:The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary distribution functions of the thickness. A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation (ODE) in the thickness coordinate which was solved analytically. Next, resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series. Some numerical examples were given to demonstrate the accuracy, efficiency of the present model, and to investigate the influence of different distributions of material properties on the temperature field. The numerical results confirm that the influence of different material distributions, gradient indices and thickness of plate to temperature field in plate can not be ignored.

 

Key words: functionally graded circular plate; variable separation method; steady heat conduction; Peano-Baker series

中南大学学报(自然科学版)
  ISSN 1672-7207
CN 43-1426/N
ZDXZAC
中南大学学报(英文版)
  ISSN 2095-2899
CN 43-1516/TB
JCSTFT
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